Junction Depth Dependence of the Gate Induced Drain Leakage in Shallow Junction Source/Drain-Extension Nano-CMOS

نویسندگان

  • Seung-Hyun Song
  • Jae-Chul Kim
  • Sung-Woo Jung
  • Yoon-Ha Jeong
چکیده

This study describes the dependence of the surface electric field to the junction depth of source/drain-extension, and the suppression of gate induced drain leakage (GIDL) in fully depleted shallow junction gate-overlapped source/drain-extension (SDE). The GIDL can be reduced by reducing shallow junction depth of drain-extension. Total space charges are a function of junction depth in fully depleted shallow junction drain-extension, and the surface potential is proportional to these charges. Because the GIDL is proportional to surface potential, GIDL is the function of junction depth in fully depleted shallow junction drain-extension. Therefore, the GIDL is suppressed in a fully depleted shallow junction drain-extension by reducing surface potential. Negative substrate bias and halo doping could suppress the GIDL, too. The GIDL characteristic under negative substrate bias is contrary to other GIDL models. key words: GIDL, junction, halo, nanoscale CMOS

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Advanced Model and Analysis of Series Resistance for CMOS Scaling Into Nanometer Regime—Part I: Theoretical Derivation

An advanced series resistance model is developed to accurately predict source/drain (S/D) series resistance of complementary metal-oxide semiconductor (CMOS) in the nanometer regime. The series resistance is modeled by dividing into four resistance components named SDE-to-gate overlap, S/D extension, deep S/D, and silicide-diffusion contact resistance considering the nonnegligible doping-depend...

متن کامل

Gate structural engineering of MOS-like junctionless Carbon nanotube field effect transistor (MOS-like J-CNTFET)

In this article, a new structure is presented for MOS (Metal Oxide Semiconductor)-like junctionless carbon nanotube field effect transistor (MOS-like J-CNTFET), in which dual material gate with different work-functions are used. In the aforementioned structure, the size of the gates near the source and the drain are 14 and 6 nm, respectively, and the work-functions are equal and 0.5 eV less tha...

متن کامل

Gate structural engineering of MOS-like junctionless Carbon nanotube field effect transistor (MOS-like J-CNTFET)

In this article, a new structure is presented for MOS (Metal Oxide Semiconductor)-like junctionless carbon nanotube field effect transistor (MOS-like J-CNTFET), in which dual material gate with different work-functions are used. In the aforementioned structure, the size of the gates near the source and the drain are 14 and 6 nm, respectively, and the work-functions are equal and 0.5 eV less tha...

متن کامل

Leakage Control for Deep-Submicron Circuits

High leakage current in deep sub-micron regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, leakage control and reduction are very important, especially for low power applications. The reduction in leakage current has to be achieved using both process and circuit level techn...

متن کامل

Hot hole-induced device degradation by drain junction reverse current

Components of drain leakage currents in the off-state of MOSFET are gate-induced drain-leakage (GIDL) and drain junction reverse currents. Device degradation phenomenon and mechanism by GIDL have been well known, but those by drain junction reverse current (IDJR). have not. In this paper, device degradation mechanisms by drain junction reverse current in the off-state were studied through I-V c...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • IEICE Transactions

دوره 91-C  شماره 

صفحات  -

تاریخ انتشار 2008